The solder paste printing process may be the most critical process in your SMT production line!
Solder paste application is a critical process. The result is strongly influenced by external factors.
Some important factors that can disrupt this process are:
- Solder paste
- Stencil time
- Production batch
- Stencil condition, wear and contamination
- Squeegee condition, wear and damage)
- Environmental variables like temperature and humidity
- Support of the circuit board, parallelism and deflection
We offer equipment, accessories and consumables to guarantee perfect application of the solder paste.
Additionaly we offer solderpaste inspection systems to detect errors or problems in the printing process, the SPC functions will enable you to find the root cause of the problems so you can optimze your process continously.
Please choose one of the following products for detailed information: