The solder paste printing process may be the most critical process in your SMT production line!
Solder paste application is a critical process because of the degree to which process quality is dependent on external factors. Some important factors that can disrupt this process are:
- Condition of the stencil (wear, contamination)
- Condition of the squeegee (wear, damage)
- Condition of the solder paste
- Stencil time
- Environmental variables
- Support of the circuit board
We are offering a complete range of equipment and consumables to guarantee perfect application of the solder paste. Additionaly we offer solderpaste inspection systems to find any possible problem in the printing process and to analyse the root cause of the problems so you can optimze your process continously.
Please choose one of the following products for detailed information: