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SMT Stencils,
PCB Depaneling, PCB Processing
LDS, MID

 

LPKF PCB Depaneling

Stress-Free Laser Depaneling of Assembled Boards

Components and printed circuit boards are becoming smaller and more sensitive. When unassembled or assembled separate boards are depanelled from a multi-image board, it is very important to reduce the forces acting on the board to a minimum. The criteria for precision and cleanliness are also becoming more and more stringent at the same time. Laser systems cut any shape of contour without exerting any mechanical stress – and do so much more precisely than conventional tools such as saws, routers or punches.

The laser cuts virtually any shape with minimal spaces between the single PCBs. Densely populated boards and closely arranged panels provide for an increased net usable surface.

In the case of flexible and very thin substrates in particular, lasers open up new options for the production of sensitive printed circuit boards.

The LPKF MicroLine series is perfect for cutting break-out tabs and complex contours in rigid, rigid-flex and flexible PCB substrates. The systems provide clean cuts in PI, FR4, FR5, and CEM materials. Further materials include polyesters, ceramics and other RF-materials.

lpkf_lasercut_boardUV Laser Cutting with LPKF MicroLine 2000 Systems

LPKF UV laser cutting systems quickly, cleanly, and precisely process even highly complicated tasks on printed circuit boards (PCBs). The new MicroLine systems are built on the solid track record of their successful predecessors. They are available in different configurations, customized for the cutting of populated and unpopulated rigid PCBs, as well as flex circuits and cover layers.

 


LPKF MicroLine 2000 P

LPKF Microline 2000P laser depaneling systemProcessing Flat Substrates

UV laser cutting systems display their advantages at various positions in the production chain. With complex electronic components, the processing of flat materials is sometimes required.
In that case, the UV laser reduces the lead time and total costs with every new product layout. The LPKF MicroLine 2000 P is optimized for these work steps.

  • Complex contours
  • No substrate brackets or cutting tools
  • More panels on the base material
  • Perforations and decaps
technical data
Max. working area (X/Y/Z) 350 mm x 350 mm x 11 mm
Max. recognition area (X/Y) 300 mm x 300 mm
Max material size (X/Y) 350 mm x 350 mm
Data input formats Gerber, X-Gerber, DXF, HPGL, Sieb & Meier, Excellon, ODB ++
Max. structuring speed Depends on application
Positioning accuracy ± 25 μm
Diameter of focused laser beam 20 μm
Laser wavelength 355 nm
System dimensions (W/ H/ D) 875 mm x 1.530 mm x 1.300 mm
Weight 450 kg
Operating conditions
Power supply 110/230 V, 50 – 60 Hz, 3 KVA
Cooling Air-cooled (internal water-air cooling)
Ambient temperature 22 °C ± 2 °C
Humidity 60 % (non-condensing)
Required accessories Exhaust unit, 320 m³/h

LPKF MicroLine 2000 S

Cutting Assembled Circuit Boards

LPKF 2000s laser depaneling systemThe UV laser cuts substrates in the immediate vicinity of sensitive components or strip conductors – without mechanical stress. Smaller components can thus be produced with a noticeably higher assembly density up to the edge of the PCB – and at the same time the process reduces the reject rate.

  • Circuit board thickness up to 1.6 mm
  • Close to strip conductors or components
  • Optimal utilization of the substrate

Integration in MES Solutions

The MicroLine 2000 S seamlessly integrates into existing manufacturing execution systems (MESs). The laser system delivers operative parameters, machine data, tracking & tracing values and information about individual production runs.

technical data
Max. working area (X/Y/Z) 350 mm x 350 mm x 11 mm
Max. recognition area (X/Y) 300 mm x 300 mm
Max material size (X/Y) 350 mm x 350 mm
Data input formats Gerber, X-Gerber, DXF, HPGL, Sieb & Meier, Excellon, ODB ++
Max. structuring speed Depends on application
Positioning accuracy ± 25 μm
Diameter of focused laser beam 20 μm
Laser wavelength 355 nm
System dimensions (W/ H/ D) 875 mm x 1.530 mm x 1.300 mm
Weight 450 kg
Operating conditions
Power supply 110/230 V, 50 – 60 Hz, 3 KVA
Cooling Air-cooled (internal water-air cooling)
Ambient temperature 22 °C ± 2 °C
Humidity 60 % (non-condensing)
Required accessories Exhaust unit, 320 m³/h

LPKF MicroLine 2000 Ci

LPKF 2000SI inline laser depaneling systemCompact, high-output and inline-capable. The technology driving the MicroLine 2000 Ci is based on the proven MicroLine 1000 series. It follows the same new modern machine layout as the first system and also has a few things to offer under the hood.

 Integration in production lines

An integrated SMEMA interface and a newly developed handling system allow the MicroLine 2000 systems to be integrated in the customers’ own production lines. They help the production managers there: The laser system can cut any contours without mechanical conversions and allows production runs with high variance.

Higher throughput

LPKF laser systems can often create components conforming to standards out of deformed base materials. In the MicroLine 2000 Ci, a highly developed vision system is used that can make corrections in the position and rotation angle of the component. The laser beam follows the contours of the real component position.

The integrated vision system and the internal infeed were further optimized for the MicroLine 2000 Ci so as to minimize non-productive time. In this way, the system can be equipped with a high-output laser source – the processing times thus drop once more and the maximum thickness of the material to be processed rises.

Integration in MES Solutions

The MicroLine 2000 Ci seamlessly integrates into existing manufacturing execution systems (MESs). The laser system delivers operative parameters, machine data, tracking & tracing values and information about individual production runs.

technical data
Max. working area (X/ Y/ Z) 300 mm x 250 mm x 11 mm
Max. recognition area (X/ Y) 200 mm x 250 mm
Max. material size 300 x 250 mm
Data input formats Gerber, X-Gerber, DXF, HPGL, Sieb & Meier, Excellon, ODB ++
Max. structuring speed Depends on application
Accuracy ± 25 μm
Diameter of focussed laser beam 20 μm
Laser wavelength 355 nm
System dimensions (W/ H/ D) 875 mm x 1.530 mm x 1.300 mm
Weight 450 kg
Operating conditions
Power supply 110/230 V, 50 – 60 Hz, 1.5 (2.1*) kW
Cooling Air-cooled (internal water-air cooling)
Compressed air 0.6 MPa
Ambient temperature 22 °C ± 2 °C
Humidity 60 % (non-condensing)
Required accessories Exhaust unit, external conveyor, production fixture