Laser depaneling, a contact-free process for separating printed circuit boards
Laser depaneling is the state of the art technology for separating individual pcb’s from the panel. The patented CleanCut technology by LPKF offers the highest cutting quality combined with a stress-free proces. This will improve the final quality and the lifespan of the final product. Laser depaneling offers unique advantages over convential pcb separating processes.
Advantages of laser depaneling:
Cutting edge quality
Design freedom
Material saving
And further:
- No mechanical contact with the PCB
- Stress-free and dust-free processing
- High cutting accuracy
- Flexibility (laser marking and drilling is possible)
- No wearing (consumption) parts
Check out the latest information about LPKF’s exciting new TENSOR technology