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3D Solderpaste measurement with Koh Young 3D SPI

Being the market and technology leader in 3D solder paste inspection systems Koh Young Technology is able to offer you top notch solutions.

Nowadays the 3D solder paste inspection system (SPI) has become an integral part of the modern SMD production line.
It’s main task is to stop the transfer of faulty printed boards to the next step in the production line.
Further the system helps to analyze weaknesses within the printing process and to optimize the parameters for the process.

With over 10 years experience and more than 13.000 installed SPI and AOI systems KohYoung has a lot of extras to offer. KohYoung is leading in accuracy, reproducibility and speed with its patented 3D measurement technology. With the perfect combination of technology, simple handling and excellent SPC analysis Koh Young is setting the standard in 3D solder paste measurement.

Inline system KY-8030 series

Koh Young 8030

The inline system can easy be integrated in your current production line and will improve the process accuracy of your production. Depending on your production needs we can offer the solution that matches your requirements.

Features:

  • Automatic width adjustment
  • Maximum PCB size: 510 x 510 mm
  • Shadow free measurement through 2/4 way projection
  • Koh Young patented phase-shift Moire analysis
  • 10/15/20 µm X/Y resolution, 0.37 µm Z-resolution
  • SPC Plus software package

Options:

  • Data connection with traceability system from customer
  • Double track model
  • External barcode reader
  • Global library
  • Ceramic compatible transport system
  • SPC Plus software for offline data analysis
  • 2D recognition of bridges and smearing

Inline system KY-aSPIre series

Koh Young Aspire

The aSPIre system is our SPI flagship, and gives you the highest process accuracy and throughput.

Features:

  • Automatic width adjustment
  • Maximum PCB size: 510 x 510 mm
  • Shadow free measurement through 4 way projection
  • Koh Young patented phase-shift Moire analysis
  • 10/15/20 µm X/Y resolution, 0.37 µm Z-resolution
  • SPC Plus software package

Options:

  • Data connection with traceability system from customer
  • Double track model
  • External barcode reader
  • Global library
  • Ceramic compatible transport system
  • SPC Plus software for offline data analysis
  • 2D recognition of bridges and smearing