Koh Young 3D Semiconductor Inspection

Meister S

Premium In-line 3D Inspection System for Micro Solder Paste Deposits

The Meister S has been qualified for mass production by major semiconductor foundries and Mini/Micro-LED companies for micro solder inspection with superior full 3D inspection performance. Combining innovative vision algorithms and high-resolution optics, the Meister S goes beyond micro solder paste inspection, but also a proven solution for Flux inspection.

Meister D/D+

Breakthrough in 3D Measurement for High-Density Substrates & Shiny Components and Highly Reflective Components

The Meister D is a perfect solution for production-speed 3D inspection for component and die inspection solution targeting die and small MLCCs using an integrated measurement tool with defect analysis software based on advanced optics and AI engines. The system inspects micro cracks, chipping, foreign material, and more.

The Meister D+ combines industry-leading Moiré technology and Koh Young’s proprietary new optics to support 3D inspection of highly reflective dies (mirror surface), a long-term inspection challenge.

Meister for WLP

The Most Optimized True 3D Inspection Solutions for Wafer-Level-Packaging Applications

The Meister Series for Wafer-Level Packaging has been qualified for mass production by major semiconductor foundries for micro solder on wafer, shiny components and highly reflective components on substrates.

Meet Meister Series for WLP with multiple resolutions and configurable options to meet the needs of WLP applications.

The Most Optimized 3D In-line SPI Solution for Advanced Packaging

The Prime has been qualified for mass production by major OSAT companies for thin solder paste inspection with superior full 3D inspection performance.