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Heller, the premier SMT oven innovation company

Curing & Back-end Semiconductor Manufacturing

Increase productivity, improve quality, reduce costs… with curing & back-end semiconductor Manufacturing solutions from Heller.
Curing & Back-end Semiconductor Manufacturing customized ovens for a variety of curing needs

Heller 788 vertical curing oven

Heller 788: In-line, continuous cure, vertical format curing oven

  • Curing cycle time of up to four hours in footprints as small as 183 cm.
  • Customized heights of 7, 8, 9, and 10 feet (213, 244, 274, and 305 cm) to meet any throughput requirement.
  • Four-zone heating with independent time and temperature controls for single and double step profiling.

Heller VCO 755 vertical curing oven

Heller VCO 755 In-line, continuous cure, vertical format Mini curing oven

  • Min Width: 75mm
  • Max Width: 250mm
  • Length: 250mm
  • Shelf Pitch: 19.05mm
  • Total carriage: 50 boards
Heller PCO 860 Pressure curing oven

Heller 860 Pressure curing oven (PCO)

A Pressure Curing Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications.

  • Process time: Generally 120 min or User’s spec
  • Operating temp: 60ºC ~ 200ºC
  • Maximum temp: 220ºC
  • Operating pressure: 1 bar – 10 bar