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MEASURE TO OPTIMIZE

A complete 3D inspection solution

 

 

3D Solderpaste measurement with Koh Young 3D SPI

Koh Young Technology offers as market and technology leading company in 3D solder paste measurement a lot of know-how and innovative systems. The Koh Young systems are ready for the highest requirements in electronic assembly.

3D solder-paste measurement is a must in modern SMT production. The basic function of 3D SPI is to prevent unacceptable quality printed pcb’s to enter the next station in the line.  But it is also the perfect tool to analyze weak points in the printing process and to optimize the complete process.

With more than 10 years experience and over 5.000 systems installed, Koh Young offers the highest value systems in the market. The patented 3D measuring technology results in the highest accuracy, reproduce-ability and inspection speed.

With the perfect combination of best technology, easiest operation and comprehensive SPC analysis, Koh Young sets the standard in 3D solder paste measurement.

Desktop system KY-3020T

Koh Young 3020T_webThe compact system KY-3020T is the perfect solution for off-line measurement in situations where in-line is not possible or desired.

Special in low volume production environment the system will improve the production yield and quality by reducing errors.

This quality improvement will result in costs savings.

Show highlights
  • Highest accuracy and reproducibility
  • Fast and easy programming
  • No shadow or reflection problems
  • Ideal for small series, R&D, and incidental verification
  • Patented 3D measuring system
  • Independent of PCB color.
  • High performance and fast return on investment

 

Show options
  • Barcode reader for traceability (1D/2D)
  • Custom table

 

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Inline system KY-8030 series

Koh Young Solder Paste Inspection system: 8030The inline system can easy be integrated in your current production line and will improve the process accuracy of your production.

Depending on your production needs we can offer the solution that matches your requirements.

Show highlights:
  • Automatic width adjustment
  • Maximum PCB size: 510 x 510 mm
  • Shadow fre measurement through 2/4 way projection
  • Koh Young patented phase-shift Moire analysis
  • 10/15/20 µm X/Y resolution, 0.37 µm Z-resolution
  • SPC Plus software package

 

Show options:
  • Data connection with traceability system from customer
  • Double track model
  • External barcode reader
  • Global library
  • Ceramic compatible transport system
  • SPC Plus software for offline data analysis
  • 2D recognition of bridges and smearing

 

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Inline system KY-aSPIre series

Koh Young Solder Paste Inspection system: Aspire

The aSPIre system is our SPI flagship, and gives you the highest process accuracy and throughput.

Show highlights:
  • Automatic width adjustment
  • Maximum PCB size: 510 x 510 mm
  • Shadow fre measurement through 4 way projection
  • Koh Young patented phase-shift Moire analysis
  • 10/15/20 µm X/Y resolution, 0.37 µm Z-resolution
  • SPC Plus software package

 

Show options:
  • Data connection with traceability system from customer
  • Double track model
  • External barcode reader
  • Global library
  • Ceramic compatible transport system
  • SPC Plus software for offline data analysis
  • 2D recognition of bridges and smearing

 

Show downloads: